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Lämpömoduuli HP M46735-001 HP 14 kannettavaan – varaosana jäähdytysyksikkö

Lämpömoduuli HP M46735-001 HP 14 kannettavaan – varaosana jäähdytysyksikkö
Lämpömoduuli HP M46735-001 HP 14 kannettavaan – varaosana jäähdytysyksikkö
151,21 €
Thermal Module HP M46735-001 for HP 14 laptop – replacement cooling assembly is a direct-fit thermal assembly designed to replace a worn or damaged cooling unit in compatible HP 14 notebooks. It includes the heat pipe, heatsink plate and contact surfaces required to transfer heat away from the proce... Lue lisää
Varasto Loppu varastostaEi varastossa Tuotekoodi 2445471 Merkki HP Malli M46735-001 Takuu 2 vuotta
KategoriaKannettavien tietokoneiden vaihtotuulettimet

Toimitus ja palautukset

Thermal Module HP M46735-001 for HP 14 laptop – replacement cooling assembly is a direct-fit thermal assembly designed to replace a worn or damaged cooling unit in compatible HP 14 notebooks. It includes the heat pipe, heatsink plate and contact surfaces required to transfer heat away from the processor and nearby components, restoring effective thermal conduction and dissipation to maintain stable operating temperatures during normal workloads.

Advantages

This replacement cooling assembly restores the original thermal path and heat dissipation efficiency without modifying the laptop chassis. The unit is designed for OEM fit and alignment, providing correct contact pressure and surface coverage for reliable heat transfer. Using a purpose-built thermal module reduces the risk of thermal throttling and system instability compared with degraded or improvised cooling solutions.

Suitable for

  • Repairing or replacing a damaged or failed cooling module in HP 14 series laptops
  • Service and refurbishment of used HP 14 notebooks to restore original cooling performance
  • Maintenance tasks where the original thermal assembly must be replaced after disassembly

Key specifications

  • Form factor: compact laptop thermal module with integrated heat pipe and heatsink plate
  • Compatibility: designed for HP 14 series notebook models requiring this specific cooling assembly layout
  • Materials: metal heat pipe(s) and aluminum or copper heatsink surfaces for thermal conduction
  • Mounting: screw and bracket mounting points matching OEM chassis locations
  • Thermal interface: factory-compatible contact surfaces intended for use with thermal paste or pads at mating surfaces

How to use

Power down the laptop, remove the battery if applicable, and open the service access panel following the manufacturer service manual or disassembly guide. Remove the existing cooling assembly by unscrewing the mounting screws and disconnecting any fan or sensor cables as required. Clean the processor and contact surfaces with appropriate solvent to remove old thermal compound. Position the replacement thermal module so that mounting points and contact surfaces align with the processor and chassis, apply fresh thermal paste or pads to the CPU and other contact areas, then secure the assembly with the original screws and reconnect any cables. Reassemble the laptop and test system operation and temperatures under typical load to confirm correct installation.

Recommendations

Use recommended thermal paste or pads and follow torque specifications for mounting screws where available. Verify compatibility with your exact HP 14 model before purchase and perform a controlled thermal test after installation to ensure proper heat dissipation. If you are not experienced with laptop repair, consider professional installation to avoid damage to delicate components.

Tärkeimmät ominaisuudet
  • Repairing or replacing a damaged or failed cooling module in HP 14 series laptops
  • Service and refurbishment of used HP 14 notebooks to restore original cooling performance
  • Maintenance tasks where the original thermal assembly must be replaced after disassembly
  • Form factor: compact laptop thermal module with integrated heat pipe and heatsink plate
  • Compatibility: designed for HP 14 series notebook models requiring this specific cooling assembly layout
  • Materials: metal heat pipe(s) and aluminum or copper heatsink surfaces for thermal conduction
  • Mounting: screw and bracket mounting points matching OEM chassis locations
  • Thermal interface: factory-compatible contact surfaces intended for use with thermal paste or pads at mating surfaces
Tekniset tiedot
Määrä pakkauksessa
1 pc(s)
Tyyppi
Heatsink
Yhteensopivat merkit
HP
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Myyjä: UAB KUR LT · Laisvės pr. 125A, LT-06118 Vilna, Liettua · Yritystunnus 303192950 · ALV-numero LT100008198612 · Toimitus EU:sta (Liettua)
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