CPU-jäähdytin Akasa AK-CC6616HP01 matala profiili kupari ja alumiini Intel LGA1700

Akasa AK-CC6616HP01 Low-profile copper and aluminum for Intel LGA1700 is a compact CPU cooler engineered for systems with restricted internal clearance. Its hybrid construction combines copper heat-spreader elements with an aluminum fin array to improve thermal conductivity while keeping overall height low. The cooler is specifically shaped to fit Intel LGA1700 socket layouts and is intended for small form-factor PCs, HTPCs and slim desktop enclosures where airflow and space are limited.

Advantages

The cooler's low-profile design reduces interference with tall memory modules and motherboard components while maintaining effective heat transfer through copper contact surfaces and aluminum fins. Its compact footprint allows installation in confined cases without sacrificing mounting stability. Designed for quiet operation, the unit minimizes fan noise under typical loads and supports consistent CPU temperature control in compact builds.

Suitable for

• Small form-factor desktop PCs where component height is limited
• Home theater PCs (HTPCs) that require a slim, unobtrusive cooler
• Slim or compact workstations with low-profile cooling requirements
• Systems using Intel LGA1700 socket processors with limited case clearance

Key specifications

• Low-profile cooler height suitable for compact enclosures
• Hybrid material construction: copper contact/heat-spreader elements and aluminum fin array
• Compatibility with Intel LGA1700 socket mechanical layout
• Compact footprint designed to avoid interference with DIMM slots and motherboard components
• Airflow-optimized fin stack to balance cooling performance and acoustic output

How to use

Prepare the motherboard and CPU by following standard ESD precautions and placing the board on a flat, stable surface. Remove any protective film from the cooler base, apply a thin, even layer of thermal paste on the CPU heat spreader if the cooler does not include pre-applied paste, align the cooler with the LGA1700 mounting points and secure it using the supplied mounting hardware. Connect the cooler fan cable to the CPU fan header on the motherboard and verify that the fan spins during system power-up. Ensure there is adequate case airflow and that the cooler does not contact tall memory modules or other components.

Recommendations

Use the cooler in cases with at least minimal front-to-back or bottom-to-top airflow and avoid overclocking beyond the CPU’s stock power limits in confined enclosures. Periodically inspect and clean the fin array and fan to maintain thermal performance and low noise levels.