CPU-jäähdytin INTER-TECH S4 1U passiivinen kannalle LGA 4677 (malli 88885613)

INTER-TECH S4 1U passive CPU cooler is a low-profile heatsink designed for Intel LGA 4677 socket processors. This fanless solution fits 1U rack and compact server systems where active cooling is impractical or noise must be minimized. The cooler dissipates heat through direct conduction to a dense fin array and passive convection, providing a compact thermal management option for space-constrained builds and noise-sensitive environments.

Advantages

The passive 1U design allows installation in shallow chassis and rackmount servers without adding fan noise. Its solid base plate ensures direct thermal contact with the CPU heat spreader while the aluminum fin stack increases surface area for efficient passive heat dissipation. With no moving parts, the cooler reduces maintenance needs and eliminates vibration and bearing wear associated with active fans.

Suitable for

• 1U rack servers and blade systems with Intel LGA 4677 processors
• Noiseless or noise-sensitive server rooms and laboratory equipment
• Compact or shallow-depth enclosures where low-profile cooling is required
• Systems prioritizing reliability and reduced maintenance over maximum thermal headroom

Key specifications

• Socket compatibility: Intel LGA 4677
• Profile: 1U low-profile, fanless heatsink
• Cooling method: Passive conduction and convection
• Material: Base plate and fin stack optimized for thermal transfer (aluminum or similar thermally conductive alloy)
• Form factor: Compact footprint for shallow chassis and rackmount servers

How to use

Install the passive cooler on a compatible Intel LGA 4677 CPU following the server or motherboard manufacturer’s mounting procedure. Apply a thin, even layer of thermal interface material to the processor heat spreader before securing the cooler to ensure good thermal contact. Verify that the chassis provides adequate airflow paths for passive convection and avoid blocking vents or other openings. After installation, monitor system temperatures under expected workloads to confirm the passive cooler meets thermal requirements.

Recommendations

Use this passive 1U cooler in systems with predictable thermal loads and adequate chassis airflow. If your processor operates at consistently high TDP or the enclosure lacks sufficient ventilation, consider active or hybrid cooling alternatives. Regularly inspect system airflow and dust accumulation; even though the cooler has no moving parts, restricted convection will reduce thermal performance.