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The InLine 33955H RAM Heat Sink is a set of four self-adhesive passive cooling fins designed to reduce operating temperature of computer memory modules. Each blue heat sink includes a pre-applied thermal conductance pad to improve contact with the RAM chip surface and support stable thermal performance during normal use and light overclocking.

Advantages

These passive heat sinks attach directly to DIMM modules to increase surface area for heat dispersion without adding noise or requiring additional power. The included thermal conductance pads help transfer heat from the memory chips to the aluminium fins, and the compact design preserves clearance for neighbouring components and airflow inside the case.

Suitable for (tasks / use cases)

Key specifications

How to use

Power off the computer and unplug it from the mains before installation. Remove the RAM module from the motherboard if necessary and clean the chip surface with isopropyl alcohol to remove dust and grease. Peel off the protective film from the thermal conductance pad and press the heat sink firmly onto the memory chip for a few seconds to ensure adhesion. Reinstall the RAM module and verify system stability and temperatures after powering on.

Recommendations

Use these passive heat sinks on standard-sized memory chips and avoid installing them where they would interfere with tall CPU coolers or adjacent expansion cards. For significant overclocking or extreme thermal loads, consider active cooling solutions or checking compatibility with your motherboard layout.