Intel Core Ultra 5 225T, Intel Core Ultra 5, LGA 1851 (Socket V1), asennus, Intel, 225T, 64-bittinen

The Intel Core Ultra 5 225T redefines mainstream desktop computing with its hybrid architecture, combining 6 high-performance P-cores and 8 efficient E-cores for a total of 14 cores and 20 threads. Unlike conventional processors, it integrates a dedicated Intel Arc GPU with 8 Xe cores, enabling smooth visuals and AI-accelerated experiences right out of the box, all within a remarkably low 35W TDP.

Highlights

• 14 cores (6P+8E) and 20 threads for responsive multitasking and gaming.
• Built-in Intel Arc graphics with 8 Xe cores for crisp 4K display and light gaming.
• Supports DDR5 memory up to 6400 MT/s and PCIe 5.0 for future-ready performance.
• Low 35W TDP ensures quiet, energy-efficient operation without sacrificing speed.
• Intel GNA 3.0 AI accelerator boosts AI workloads like noise cancellation and voice recognition.

In daily use

From office productivity to content creation, the 225T handles it all with ease. The P-cores reach up to 4.8 GHz for bursty single-threaded tasks, while the E-cores efficiently manage background processes, keeping the system cool and quiet. The integrated Arc GPU eliminates the need for a discrete card in compact builds, making it perfect for home theatre PCs, office desktops, and entry-level gaming rigs.

Full specifications

• Processor model: Intel Core Ultra 5 225T
• Socket: LGA 1851 (Socket V1)
• Total cores: 14 (6 Performance-cores + 8 Efficient-cores)
• Total threads: 20
• P-core base clock: 2.2 GHz
• Max turbo frequency: 4.8 GHz
• Intel Smart Cache (L3): 24 MB
• Processor graphics: Intel Arc Graphics (8 Xe cores)
• TDP: 35W
• Memory support: DDR5 up to 6400 MT/s, max 192 GB
• PCI Express: 5.0, 20 lanes
• Instruction set: 64-bit
• Virtualization: Intel VT-x, Intel VT-d
• AI accelerator: Intel GNA 3.0

Final note

For builders seeking a powerful yet efficient foundation for next-gen systems, the Core Ultra 5 225T delivers exceptional value with its integrated graphics and AI capabilities, all in a compact thermal envelope.