Lämpötahna Kolink Core TX-8 1,5 g (KL-TX8-1) — lämpötahna CPU/GPU:lle

Kolink Core TX-8 is a thermal interface compound supplied in a 1.5 g tube intended for use between CPU or GPU heat spreaders and cooling solutions. The paste improves thermal conductivity across the interface, helping transfer heat from semiconductor packages to heatsinks, coolers or integrated cooling blocks. Its small tube format is convenient for precise application during PC builds, upgrades and routine maintenance where only a small quantity is required.

Advantages

The compound offers consistent viscosity for controlled spreading and good surface contact, reducing air gaps that degrade heat transfer. Packaged in a compact tube, it is easy to store and apply a measured amount without excess waste. The formulation is compatible with typical metal and ceramic heat spreaders and standard heatsink surfaces, supporting reliable thermal performance in compact and full‑size systems.

Suitable for

• Applying thermal interface material to desktop and laptop CPUs
• Replacing or topping up thermal paste on GPUs and compact graphics modules
• Small repairs, single-component upgrades and maintenance tasks
• Precise applications where only a small quantity of paste is needed

Key specifications

• Net weight: 1.5 g in a dispensing tube
• Form: viscous thermal compound suitable for manual application
• Intended use: thermal interface between semiconductor heat spreaders and cooling solutions
• Compatibility: designed for use with typical CPU and GPU heat spreaders and heatsink surfaces

How to use

Clean both the processor heat spreader and heatsink contact surface with isopropyl alcohol and a lint‑free cloth before application. Apply a small, pea-sized amount of Kolink Core TX-8 to the center of the heat spreader, then mount the cooler and secure it following the manufacturer’s mounting procedure; pressure from the cooler will spread the paste into a thin, even layer. For larger dies or nonstandard surfaces use an appropriate amount to ensure coverage while avoiding excess paste that can reduce thermal transfer efficiency.

Recommendations

Store the tube in a cool, dry place and keep it capped when not in use. Replace the thermal paste during major component changes or if operating temperatures rise noticeably. Use a single, controlled application to avoid contamination of surrounding components; if unsure, consult the cooler or motherboard manual for suggested application patterns and mounting torque.