Lämpötyyny DeLOCK 18469 3,2 W/m·K harmaa 20x120x1,5 mm

The DeLOCK 18469 thermal pad is a grey, silicone-based thermal interface material designed to improve heat dissipation for electronic components such as M.2 modules. With a thermal conductivity of 3.2 W/m·K and dimensions of 20 x 120 x 1.5 mm, the pad helps reduce operating temperatures and can contribute to more stable performance and extended component lifespan. The pad is supplied in a polybag and manufactured in China/Taiwan.

Advantages

This thermal pad offers a thermal conductivity of 3.2 W/m·K for efficient heat transfer and comes in a slim 1.5 mm thickness suitable for compact assemblies. It features low oil bleeding, which minimises contamination of electronic contacts and preserves the pad’s thermal and mechanical properties over time to maintain even and stable heat dissipation.

Suitable for

• Thermal management of M.2 SSD modules
• Heat dissipation between chips and heatsinks in compact devices
• Replacing or upgrading existing thermal pads in laptops, mini-PCs and embedded systems
• Applications requiring a grey silicone thermal pad with low oil bleeding

Key specifications

• Brand: DELOCK
• Model / MPN: 18469
• Thermal conductivity: 3.2 W/m·K
• Dimensions (W x D x H): 20 x 120 x 1.5 mm
• Colour: Grey
• Packaging: Polybag
• Origin: China / Taiwan
• EAN: 4043619184699

How to use

Clean the contact surfaces thoroughly to remove dust, grease or old thermal material. Cut the DeLOCK thermal pad to the required size if necessary, peel off the protective liner and place the pad between the heat-generating component (for example an M.2 SSD) and the heatsink or metal cover. Apply gentle, even pressure to ensure full contact and avoid air gaps. Reassemble the device following the manufacturer’s instructions.

Recommendations

For optimal results, use the pad where a 1.5 mm thickness provides adequate contact pressure. Avoid stretching the pad during installation and keep it away from open flames or temperatures beyond the component manufacturer’s specified limits.