MITAC CPU-jäähdytyssiili Intel LGA4677 2U-palvelimelle (passiivinen, 1 kpl)

Passive 2U server heatsink engineered for Intel LGA4677 sockets, delivering reliable thermal management for Intel Xeon Scalable processors up to 350W TDP when paired with adequate system airflow.

Advantages

Six copper heat pipes and a copper base with aluminum fins ensure rapid heat transfer away from the CPU, maintaining peak performance under sustained loads. The screw-down mounting provides secure, even pressure across the processor integrated heat spreader, while the 2U form factor fits standard rack chassis with front-to-back airflow designs.

Suitable for

• Intel Xeon Sapphire Rapids (4th Gen Scalable) processors
• 2U rackmount servers and workstations with LGA4677 sockets
• Supermicro X13 series motherboards and compatible Intel M50FCP platforms
• Data centers requiring passive cooling with chassis-level airflow

Key specifications

• Socket compatibility: Intel LGA4677
• Cooling type: Passive heatsink (no fan included)
• Max TDP support: Up to 350W (system airflow dependent)
• Heat pipes: 6 copper pipes
• Base plate material: Copper
• Fin material: Aluminum
• Mounting: Screw-down
• Thermal interface material: Not included (sold separately)
• RoHS compliant

Recommendations

Ensure your chassis provides sufficient front-to-back airflow for passive cooling. Apply a high-quality thermal paste before installation. Verify motherboard standoff and backplate compatibility with LGA4677 specifications.