Muistimoduuli G.Skill DDR3 32 GB 2400 MHz 4 x 8 GB

The G.SKILL RipjawsX Series DDR3 kit in a 4 x 8GB configuration provides 32 GB total capacity at 2400 MHz with CAS latency 11. Designed for dual-channel systems, this memory module is compatible with a wide range of Intel and AMD platforms and includes Intel XMP profiles for simplified performance tuning. The modules feature an aluminum heat spreader with a finned design to improve heat dissipation during extended computing or gaming sessions.

Advantages

The RipjawsX kit offers high capacity and a relatively high clock speed for DDR3 platforms, together with tested compatibility across many motherboards. Intel XMP support enables easy overclocking on supported systems. The aluminum heat spreader increases surface area for better cooling, contributing to stable operation under load.

Suitable for

• Multitasking and running many applications simultaneously
• Gaming on systems using DDR3 memory
• Content creation and editing workloads that benefit from larger RAM capacity
• System builders and enthusiasts seeking tested DDR3 performance

Key specifications

• Total capacity: 32 GB (4 x 8 GB)
• Memory type: DDR3
• Operating frequency: 2400 MHz
• CAS latency: 11
• Operating voltage: 1.5–1.65 V
• Form factor: DIMM (desktop)
• Heat spreader: aluminum, finned design for improved airflow

How to use

Install each DIMM into the matching memory slots on a compatible desktop motherboard, observing the motherboard manual for proper slot population to enable dual-channel operation. Enable the appropriate XMP profile in the BIOS/UEFI to set the module to its specified 2400 MHz timing and voltage. After installation, verify system stability with your preferred diagnostic or stress-testing tools.

Recommendations

For best results, populate the motherboard slots as recommended by the motherboard manufacturer to run in dual-channel mode. When enabling XMP, confirm that the motherboard and CPU support the selected frequency and voltage. Use adequate case ventilation to maintain low memory temperatures during sustained high load.