Steinel 70120 liimapuikko

The Steinel 70120 adhesive stick is a low-melt hot glue designed for bonding temperature-sensitive materials. Supplied in packs of 20 sticks with a total capacity of 600 g, it is formulated to work at a low application temperature to reduce the risk of heat damage to substrates. The glue sets quickly and is suitable for a range of light- to medium-duty assembly tasks when used with a compatible low-temperature hot glue gun.

Advantages

With an application temperature of approximately 130°C, this low-melt adhesive stick minimizes thermal stress on sensitive substrates such as PU foam and polystyrene. The material becomes firm within a maximum of 80 seconds and reaches a strong bond after about 40 seconds. The product is offered in multi-pack form (20 pieces) and is suitable for handheld hot glue gun use within the specified ambient temperature range.

Suitable for

• Bonding PU foam components
• Attaching polystyrene parts and trim
• Light craft and model-making assemblies
• Temporary fixes and quick repairs on heat-sensitive surfaces

Key specifications

• Brand: Steinel
• Manufacturer part number (MPN): 70120
• EAN: 4007841052409
• Pack quantity: 20 pieces (total capacity 600 g)
• Application temperature: approx. 130°C
• Setting time: material firm within up to 80 seconds; strong bond after approx. 40 seconds
• Drying/cure reference: 12 hours (manufacturer guidance)
• Recommended operating ambient temperature: 5–50°C

How to use

Use the Steinel 70120 adhesive sticks with a compatible low-temperature hot glue gun. Preheat the glue gun according to the gun manufacturer’s instructions, insert a stick and allow the glue to reach working temperature. Apply the molten adhesive to one of the surfaces to be joined, press parts together within the recommended working time, and hold until the joint firms (typically becoming firm within 80 seconds and developing higher strength after about 40 seconds). Allow the assembly to fully cure for the recommended drying period when required.

Recommendations

For best results, test adhesion on a small, inconspicuous area of heat-sensitive materials before full application. Use at recommended ambient temperatures (5–50°C) and with a low-temperature glue gun to avoid substrate deformation. Times given for setting and bonding are approximate and depend on part size, contact area and environmental conditions.