Telegärtner OAD-lähtömoduuli 4 x duplex LC, alpinvalkoinen (H02051C0072)

This OAD output module provides four duplex LC connections in a compact, snap-in unit for Telegärtner's Optical Access Device system. Unlike single-port alternatives, it consolidates eight fibers into one Alpine White module, simplifying installation in FTTx, LAN, and data center environments. The tool-free mounting and modular design allow quick integration without special tools.

Highlights

• 4 x Duplex LC (8 simplex LC ports) for high-density fiber termination
• Alpine White (RAL 9010) polycarbonate housing, halogen-free and flame-retardant (UL 94 V-0)
• Snap-in module for OAD systems, tool-free installation
• Operating temperature range -40 °C to +85 °C, suitable for harsh environments
• Compliant with RoHS and REACH

In daily use

The module's compact footprint and modular design make it ideal for structured cabling in telecommunications rooms, office buildings, and data centers. Its LC duplex interface ensures reliable connections for high-speed optical networks. The white housing blends seamlessly with standard wall outlets and patch panels, maintaining a clean aesthetic.

Full specifications

• Product Type: Fiber Optic Outlet Module
• Connector Interface: LC
• Port Configuration: 4 x Duplex LC (8 simplex LC ports)
• Color: Alpine White (RAL 9010)
• Housing Material: Polycarbonate (PC)
• Mounting Type: Snap-in module for OAD systems
• Application Area: FTTx, LAN, Data Centers, Building Cabling
• Compatibility: Telegärtner OAD series components
• Fiber Capacity: 4 Duplex LC connections
• Design Feature: Modular, tool-free installation
• Operating Temperature: -40 °C to +85 °C
• Storage Temperature: -40 °C to +85 °C
• Humidity: 5% to 95% non-condensing
• Flammability Rating: UL 94 V-0
• RoHS Compliance: Yes
• REACH Compliance: Yes
• Halogen-free: Yes
• Manufacturer Series: OAD (Optical Access Device)

Final note

This module is a key component for building scalable fiber optic networks with Telegärtner's OAD system, offering high port density and reliable performance in a compact form factor.