ARCTIC TP-3 Premium Performance lämpötyyny 100 x 100 mm, 1 mm

High Performance - very soft

Based on silicone and a special filler, TP-3 also outperforms high-performance pads, especially when height differences of closely spaced chips typically occur due to manufacturing tolerances. The TP-3 offers excellent thermal conductivity despite extremely low hardness.

Minimization of thermal resistance

The thinner the pad, the lower the termal resistance. The TP-3 pad with a thickness of 0.5 mm can easily be compressed to 0.3 mm and thus compensate for height differences between various components of up to 0.2 mm. Please note that due to the extremely low hardness, the installation of the 0.5 mm pad requires extra care. Please refer to the user manual.

Versatile Applications

Heat-conducting, vibration-damping, mouldable, electrically insulating - safe and easy to use. Thanks to its good compression properties, the soft heat conduction pad is particularly gentle on components and at the same time a good heat conductor. In addition to the standard format for M.2, the TP-3 is available in various sizes and thicknesses, which can be easily cut to the desired shape and size. This makes it ideal for RAMs, chipsets and ICs of all kinds, which are used in PCs, laptops, consoles, graphics cards and electronic devices in general.

Safe handling

The ARCTIC TP-3 is electrically insulating, non-adhesive and easy to handle. This means that optimal and safe heat transfer can be ensured in many application areas.

Bridging gaps

The TP-3 are softer than conventional pads and therefore particularly suitable for different chip heights and possible tolerances. Thanks to their good compressibility properties, the thermal pads act as the perfect gap filler and bridges uneven surface and air gaps without stressing sensitive and protruding components.

Available in different thicknesses and sizes

Our thermal pads are available in a choice of 0.5 mm, 1.0 mm and 1.5 mm. The 0.5 mm variant is ideally suited as an alternative to heat-conducting foil. The pads are available in different dimensions, depending on their thickness. If required, the pads can also be independently cut to any size.

How to use

Apply a small, controlled amount of MX thermal compound to the heat source and spread or allow the heatsink pressure to create a thin uniform layer; follow the manufacturer’s guidelines for exact quantity. For components where paste is unsuitable, select an appropriately sized thermal pad and place it between surfaces, ensuring full contact and proper alignment. Clean mating surfaces before applying any thermal interface and reapply when replacing or servicing components.

Recommendations

Use paste for direct chip-to-heatsink interfaces where minimal thermal resistance is critical; use thermal pads for irregular gaps or components requiring non-messy, repeatable replacements. Store thermal materials at recommended temperatures and replace them if damaged or contaminated.