Intel 2U -jäähdytyssiili LGA4677-palvelinjärjestelmille M50FCP2UR208, M50FCP2UR312 (EGSM2UHSSTD)

The Intel EGSM2UHSSTD is a high-performance passive CPU heatsink designed for 2U rack server systems. Engineered for Intel's 4th Gen Xeon Scalable processors (Sapphire Rapids), it ensures reliable thermal management in demanding data center environments. This heatsink is specifically compatible with Intel Server Systems M50FCP2UR208 and M50FCP2UR312, providing a perfect fit and optimal cooling performance.

Advantages

Passive cooling design eliminates moving parts, reducing noise and increasing reliability. The aluminum fin array with copper base offers excellent heat dissipation. Pre-applied thermal interface material simplifies installation. Screw-down mounting ensures secure attachment and consistent thermal contact.

Suitable for

• Intel Server System M50FCP2UR208
• Intel Server System M50FCP2UR312
• 2U rack server configurations
• 4th Gen Intel Xeon Scalable processors (LGA4677)

Key specifications

• Product Type: CPU Heatsink
• Socket Compatibility: Intel LGA4677
• Server Rack Unit Compatibility: 2U
• Cooling Method: Passive
• Fan Included: No
• Material: Aluminum fins with Copper base
• Mounting Type: Screw-down
• Thermal Interface Material: Pre-applied
• Target System Type: Server

Recommendations

For optimal thermal performance, ensure proper airflow within the server chassis. This heatsink is designed for use with Intel's standard performance thermal solution and is ideal for enterprise data centers requiring reliable, low-maintenance cooling.