Jäähdytyssiili/jäähdytin Dynatron K129

The Dynatron K129 is a copper heatsink designed for efficient heat dissipation in server and desktop processors. It is a passive 1U-compatible heat sink suitable for systems that require low-profile cooling and is compatible with LGA1156 (Socket H) platforms. The copper construction improves thermal conductivity to help maintain lower CPU temperatures under sustained loads.

Advantages

The copper body provides improved heat transfer compared with typical aluminum sinks, while the compact, low-profile design fits 1U server environments and space-constrained desktop builds. It is a durable, maintenance-free passive solution that requires no fan and reduces moving parts and noise in the system.

Suitable for

• Intel Core i5-750 based systems
• Intel Core i7-860 and i7-870 systems
• Intel Xeon 3400 series servers
• 1U rackmount servers and compact workstations using LGA1156 (Socket H)

Key specifications

• Type: Heatsink/Radiator
• Material / colour: Copper colour
• Supported processor sockets: LGA 1156 (Socket H)
• Weight: 0.49 kg
• Form factor: Passive, 1U-compatible
• Brand / MPN / EAN: Dynatron / 88885120 / 0855700010015

How to use

Mount the Dynatron K129 on a compatible LGA1156 socket following the server or motherboard manufacturer’s mounting instructions. Ensure the CPU and heatsink contact surfaces are clean, apply an appropriate amount of thermal interface material, and secure the heatsink to the retention mechanism specified for your chassis. Because it is a passive heatsink, verify that your system’s chassis airflow is sufficient to carry heat away from the sink in 1U or compact enclosures.

Recommendations

Use the Dynatron K129 with compatible LGA1156 CPUs such as Intel Core i5-750, Core i7-860/870 and Xeon 3400 series. Confirm chassis airflow and ambient temperature limits for passive cooling; if airflow is limited, consider an active cooling solution. Periodically inspect mounting and thermal interface integrity during routine maintenance.