LogiLink lyijytön juotostina Sn99.3Cu0.7, 0,56 mm, 12,5 g annostelurasia

On a crowded workbench, an electronics technician repairs a delicate SMD board, feeding solder from a dispenser box that keeps the wire tangle-free. This LogiLink lead-free soldering wire with Sn99.3Cu0.7 alloy and 0.56 mm diameter is made for fine-pitch joints on circuit boards, delivering consistent results for manual soldering, rework, and prototyping. The no-clean flux leaves transparent, non-corrosive residues that are electrically safe, so you can skip post-soldering cleanup.

Key specifications

• Alloy composition: Sn99.3Cu0.7 (lead-free)
• Wire diameter: 0.56 mm
• Wire weight: 12.5 g
• Flux type: No-clean, 2.5% content, REL0 classification per J-STD-004
• Melting point: 227 °C
• Halide content: <0.5%
• Specific gravity: approx. 7.3 g/cm³
• Packaging: dispenser box for easy handling
• RoHS compliant

Why choose it

This solder wire combines a low melting point with a no-clean flux that minimizes post-soldering cleanup. The transparent residue is non-corrosive and electrically safe, ensuring long-term reliability of your connections. The dispenser box keeps the wire tangle-free and protected, making it easy to dispense just the right amount for each joint.

Ideal use cases

• Manual soldering of through-hole and SMD components
• Rework and repair of electronic assemblies
• Prototyping and hobby electronics projects
• Fine-pitch soldering where precision is critical

Good to know

The solder has a shelf life of 2 years when stored properly. The low odor and halide-free formulation contribute to a safer working environment. Always follow standard soldering safety practices and ensure adequate ventilation.