Nestemäisen jäähdytyksen sarja Xilence XC998 12 cm valkoinen keraaminen laakeri

The Xilence XC998 liquid cooling kit combines high cooling capacity and an elegant white design for modern PC builds. Equipped with a 120 mm ARGB fan with ceramic bearing, a high TDP rating and flexible tubes, this all-in-one cooler is intended to provide reliable cooling for demanding CPUs while adding a refined visual accent to the system.

Advantages

The XC998 delivers efficient heat dissipation with a Thermal Design Power (TDP) of 350 W and a high airflow 120 mm fan (76 m³/h). Pre-installed ARGB and PWM fans and combined pump/fan cabling simplify installation and cable management. Durable ceramic bearing and flexible, long tubes support stable operation and easy mounting. The white high-gloss finish and Infinity Mirror LED effect provide a modern, customizable appearance.

Suitable for

• Cooling high-performance desktop CPUs with up to 350 W TDP
• Gaming PCs and compact workstations requiring effective all-in-one cooling
• Systems where ARGB lighting and a white aesthetic are desired
• Builders who prefer simplified cable management with combined pump and fan cable

Key specifications

• Type: Liquid cooling kit
• Fan diameter: 120 mm
• Fan airflow: 76 m³/h
• Bearing type: Ceramic bearing
• Thermal Design Power (TDP): 350 W
• Supported sockets: Socket AM5, AM4, LGA 1700, LGA 1200, LGA 1156, LGA 1155, LGA 1151, LGA 1150
• Product colour: White
• MPN: LQ360G.W.ARGB
• EAN: 4044953503948
• Weight: 1.8 kg

How to use

Mount the radiator and fans into a compatible case opening, following the case manufacturer’s instructions. Install the pump/block assembly onto the CPU socket corresponding to your processor using the supplied mounting hardware. Connect the combined fan/pump cable to the motherboard headers for ARGB and PWM control, and configure lighting and fan profiles in the motherboard or controller software. Verify secure fittings and apply thermal paste as instructed before powering on the system.

Recommendations

Use this cooler in systems that match the supported socket list and do not exceed the specified TDP. Ensure adequate case airflow and periodically check fan operation and radiator dust levels to maintain optimal cooling performance and prolong component life.