Taustalevy Alphacool 13072 metalli musta 86x67x86mm

The Alphacool 13072 Metal Black backplate is a compact metal accessory designed to complement PC cooling assemblies. With dimensions of 86×67×86 mm and a matte black finish, this backplate provides a solid mounting surface and additional thermal mass to help stabilize component temperatures. It is engineered to integrate with compatible cooling components and to fit into constrained internal layouts where space and effective heat dissipation are required.

Advantages

The metal construction offers mechanical rigidity and improved heat conduction compared with plastic alternatives, while the black surface reduces visible reflections inside the case. Its compact footprint allows installation in tight spaces without adding excessive bulk. The consistent dimensions make alignment with existing mounting points straightforward, supporting reliable installation and stable contact with adjacent cooling parts.

Suitable for

• Supplementing GPU or chipset cooling solutions in compact or mid-tower systems
• Adding thermal mass to improve passive heat dissipation
• Providing a durable mounting interface for aftermarket cooling components

Key specifications

• Material: metal construction for rigidity and thermal conduction
• Finish: black surface treatment
• External dimensions: 86 mm (width) × 67 mm (depth) × 86 mm (height)
• Compact form factor suitable for constrained internal layouts

How to use

Position the backplate against the component or assembly it is intended to support, aligning it with the existing mounting points in the case or cooling hardware. Secure using appropriate fasteners supplied with your cooling components or existing screws from the system; do not overtighten to avoid deformation. Confirm that the backplate makes even contact where thermal conduction is required and that it does not obstruct other components or cable routing.

Recommendations

For reliable performance, pair the metal backplate with compatible cooling hardware and verify clearance inside the chassis before installation. If used as part of a liquid or passive cooling setup, ensure proper contact with thermal interfaces and monitor component temperatures after installation to confirm expected heat dissipation behavior.